Flip Chip

Flip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is flowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.

Read more about Flip ChipProcess Steps, History, Alternatives

Other articles related to "chip, flip chip, flip, flip chips":

Ball Grid Array - Variants
... CABGA Chip Array Ball Grid Array CTBGA Thin Chip Array Ball Grid Array CVBGA Very Thin Chip Array Ball Grid Array DSBGA Die-Size Ball Grid Array FBGA or Fine ... contacts and is mainly used in system-on-a-chip designs ... FCmBGA Flip Chip Molded Ball Grid Array LFBGA Low-profile Fine-pitch Ball Grid Array UFBGA and UBGA and Ultra Fine Ball Grid Array based on pitch ball grid array ...
Thermal Copper Pillar Bump - A Brief History of Solder and Flip Chip/chip Scale Packaging
... Solder bumping technology (the process of joining a chip to a substrate without shorting using solder) was first conceived and implemented by IBM in the early ‘60s ... This system became known as the controlled collapse chip connection (C3 or C4) ... Until the mid-90’s, this type of flip-chip assembly was practiced almost exclusively by IBM and Delco ...
Thermal Management Of High-power LEDs - Passive Thermal Designs - Package Type
... Flip chip - The concept is similar to flip-chip in package configuration widely used in the silicon integrated circuit industry ... The flip-chip joint can be eutectic, high-lead, lead-free solder or gold stub ... The primary source of light comes from the back side of the LED chip, and there is usually a built-in reflective layer between the light emitter and the ...
Flip Chip - Alternatives
... Since the flip chip's introduction a number of alternatives to the solder bumps have been introduced, including gold balls or molded studs, electrically conductive polymer and the "plated bump" process ... Flip chips have recently gained popularity among manufacturers of cell phones, pagers and other small electronics where the size savings are valuable ...
Thermal Copper Pillar Bump
... is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use ... and add thermal management functionality locally on the surface of a chip or to another electrical component ... active thermal management functionality at the chip level in the same manner that transistors, resistors and capacitors are integrated in conventional circuit designs today ...

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