Lift-off process in microstructuring technology is a method of creating structures (patterning) of a target material on the surface of a substrate (ex. wafer) using a sacrificial material (ex. Photoresist). It is an additive technique as opposed to more traditional subtracting technique like etching. The scale of the structures can vary from the nanoscale up to the centimeter scale or further, but are typically of micrometric dimensions.
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... Lift-offprocess is used mostly to create metallic interconnections ... There are several types of lift-offprocesses, and what can be achieved depends highly on the actual process being used ... The lift-offprocess can also involve multiple layers of different types of resist ...