Reflow Soldering

Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint. Heating may be accomplished by passing the assembly through a reflow oven or under an infrared lamp or by soldering individual joints with a hot air pencil.

Reflow soldering is the most common method of attaching surface mount components to a circuit board. The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.

Read more about Reflow SolderingPreheat Zone, Thermal Soak Zone, Reflow Zone, Cooling Zone, Etymology, Thermal Profiling

Other articles related to "reflow soldering, reflow":

Surface-mount Technology - Assembly Techniques
... The boards are then conveyed into the reflow soldering oven ... One is to use infrared lamps this is called infrared reflow ... points which use a method called vapor phase reflow ...
Reflow Soldering - Thermal Profiling
... automatically recalibrates the PWI values for the peak, slope, reflow, and soak processes ... By setting PWI values, engineers can ensure that the reflow soldering work does not overheat or cool too quickly ...