Solder - Solder Alloys

Solder Alloys

















Composition M.P. °C
S/L
Toxic Eutectic Comments Sn Pb Ag Cu Sb Bi In Zn Cd Au oth.
Pb98Sn2 316/322 Pb no Non-critical sealing and joining. Body solder. 2 98
Pb97Sn3 314/320 Pb no Sn3 3 97
Pb96Sn4 299/310 Pb no Used for coating steel and copper, to provide resistance against mild acids and seawater. 4 96
Pb95Sn5 308/312 301/314 Pb no Sn5, UNS L54320, ASTM5A, ASTM5B. Low cost and good bonding properties. Used for coating steel and copper. Used in both SMT (Surface-mount technology) and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those. useful for high-temperature service and step soldering. Remains ductile at very low temperatures, can be used for parts subject to vibration at cryogenic applications. Pb93.5Sn5Ag1.5 provides superior wetting and better strength. 5 95
Pb93Sn7 288/308 Pb no Used for coating steel to provide corrosion resistance, allows subsequent soldering. 7 93
Pb90Sn10 268/302 275/302 Pb no Sn10, UNS L54520, ASTM10B. Balls for CBGA components, replaced by SnAg3.9Cu0.6. Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those. Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder. Has low thermal EMF, can be used as an alternative to Cd70 where parasitic thermocouple voltage has to be avoided. 10 90
Pb88Sn12 254/296 Pb no Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder. 12 88
Pb85Sn15 227/288 Pb no Used for coating tubes and sheets and fabrication of car radiators. Body solder. 15 85
Pb80Sn20 183/280 Pb no Sn20, UNS L54711. Used for coating radiator tubes for joining fins. 20 80
Pb75Sn25 183/266 Pb no Crude solder for construction plumbing works, flame-melted. Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder. 25 75
Pb70Sn30 185/255 183/257 Pb no Sn30, UNS L54280, crude solder for construction plumbing works, flame-melted, good for machine and torch soldering. Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder. 30 70
Pb68Sn32 253 Pb no "Plumber solder", for construction plumbing works 32 68
Pb68Sn30Sb2 185/243 Pb no Pb68 30 68 2
Sn30Pb50Zn20 177/288 Pb no Economical solder for repairing & joining most metals including Aluminum and cast Iron. Have been the used for cast Iron and galvanized surface repair. 30 50 20
Pb67Sn33 187–230 Pb no PM 33, crude solder for construction plumbing works, flame-melted, temperature depends on additives 33 67
Pb65Sn35 183/250 Pb no Sn35. Used as a cheaper alternative of Sn60Pb40 for wiping and sweating joints. 35 65
Pb60Sn40 183/238 183/247 Pb no Sn40, UNS L54915. For soldering of brass and car radiators. For bulk soldering, and where wider melting point range is desired. For joining cables. For wiping and joining lead pipes. For repairs of radiators and electrical systems. 40 60
Pb55Sn45 183/227 Pb no For soldering radiator cores, roof seams, and for decorative joints. 45 55
Sn50Pb50 183/216 183–212 Pb no Sn50, UNS L55030. "Ordinary solder", for soldering of brass, electricity meters, gas meters, formerly also tin cans. General purpose, for standard tinning and sheetmetal work. Becomes brittle below −150 °C. Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those. For wiping and assembling plumbing joints for non-potable water. 50 50
Sn50Zn49Cu1 200/300 Pb no Lead free galvanizing product designed to replace leaded formulations now on the market. 50 1 49
Sn50Pb48.5Cu1.5 183/215 Pb no Savbit, Savbit 1, Sav1. Minimizes dissolution of copper. Originally designed to reduce erosion of the soldering iron tips. About 100 times slower erosion of copper than ordinary tin/lead alloys. Suitable for soldering thin copper platings and very thin copper wires. 50 48.5 1.5
Sn60Pb40 183/190 183/188 Pb near Sn60, ASTM60A, ASTM60B. Common in electronics, most popular leaded alloy for dipping. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those. Slightly cheaper than Sn63Pb37, often used instead for cost reasons as the melting point difference is insignificant in practice. On slow cooling gives slightly duller joints than Sn63Pb37. 60 40
Sn60Pb38Cu2 183/190 Pb Cu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. 60 38 2
Sn60Pb39Cu1 Pb no 60 39 1
Sn62Pb38 183 Pb near "Tinman's solder", used for tinplate fabrication work. 62 38
Sn63Pb37 182 183 Pb yes Sn63, ASTM63A, ASTM63B. Common in electronics; exceptional tinning and wetting properties, also good for stainless steel. One of most common solders. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those. Sn60Pb40 is slightly cheaper and is often used instead for cost reasons, as the melting point difference is insignificant in practice. On slow cooling gives slightly brighter joints than Sn60Pb40. 63 37
Sn63Pb37P0.0015–0.04 183 Pb yes Sn63PbP. A special alloy for HASL machines. Addition of phosphorus reduces oxidation. Unsuitable for wave soldering as it may form metal foam. 63 37 P
Sn62Pb37Cu1 183 Pb yes Similar to Sn63Pb37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. 62 37 1
Sn70Pb30 183/193 Pb no Sn70 70 30
Sn90Pb10 183/213 Pb no formerly used for joints in food industry 90 10
Sn95Pb5 238 Pb no plumbing and heating 95 5
Pb92Sn5.5Ag2.5 286/301 Pb no For higher-temperature applications. 5.5 92 2.5
Pb80Sn12Sb8 Pb no Used for soldering iron and steel 12 80 8
Pb80Sn18Ag2 252/260 Pb no Used for soldering iron and steel 18 80 2
Pb79Sn20Sb1 184/270 Pb no Sb1 20 79 1
Pb55Sn43.5Sb1.5 Pb no General purpose solder. Antimony content improves mechanical properties but causes brittleness when soldering cadmium, zinc, or galvanized metals. 43.5 55 1.5
Sn43Pb43Bi14 144/163 Pb no Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. Useful for step soldering. 43 43 14
Sn46Pb46Bi8 120/167 Pb no Bi8 46 46 8
Bi52Pb32Sn16 96 Pb yes? Bi52. Good fatigue resistance combined with low melting point. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. 16 32 52
Bi46Sn34Pb20 100/105 Pb no Bi46 34 20 46
Sn62Pb36Ag2 179 Pb yes Sn62. Common in electronics. The strongest tin-lead solder. Appearance identical to Sn60Pb40 or Sn63Pb37. Crystals of Ag3Sn may be seen growing from the solder. Extended heat treatment leads to formation of crystals of binary alloys. Silver content decreases solubility of silver, making the alloy suitable for soldering silver-metallized surfaces, e.g. SMD capacitors and other silver-metallized ceramics. Not recommended for gold. General-purpose. 62 36 2
Sn62.5Pb36Ag2.5 179 Pb yes 62.5 36 2.5
Pb88Sn10Ag2 268/290 267/299 Pb no Sn10, Pb88. Silver content reduces solubility of silver coatings in the solder. Not recommended for gold. Forms a eutectic phase, not recommended for operation above 120 °C. 10 88 2
Pb90Sn5Ag5 292 Pb yes 5 90 5
Pb92.5Sn5Ag2.5 287/296 299/304 Pb no Pb93. 5 92.5 2.5
Pb93.5Sn5Ag1.5 296/301 305/306 Pb no Pb94, HMP alloy, HMP. Service temperatures up to 255 °C. Useful for step soldering. Also can be used for extremely low temperatures as it remains ductile down to −200 °C, while solders with more than 20% tin become brittle below −70 °C. Higher strength and better wetting than Pb95Sn5. 5 93.5 1.5
Pb95.5Sn2Ag2.5 299/304 Pb no 2 95.5 2.5
In97Ag3 143 yes Wettability and low-temperature malleability of indium, strength improved by addition of silver. Particularly good for cryogenic applications. Used for packaging of photonic devices. 3 97
In90Ag10 143/237 no Nearly as wettable and low-temperature malleable as indium. Large plastic range. Can solder silver, fired glass and ceramics. 10 90
In75Pb25 156/165 Pb no Less gold dissolution and more ductile than lead-tin alloys. Used for die attachment, general circuit assembly and packaging closures. 25 75
In70Pb30 160/174 165/175 Pb no In70. Suitable for gold, low gold-leaching. Good thermal fatigue properties. 30 70
In60Pb40 174/185 173/181 Pb no In60. Low gold-leaching. Good thermal fatigue properties. 40 60
In50Pb50 180/209 178/210 Pb no In50. Only one phase. Resoldering with lead-tin solder forms indium-tin and indium-lead phases and leads to formation of cracks between the phases, joint weakening and failure. On gold surfaces gold-indium intermetallics tend to be formed, and the joint then fails in the gold-depleted zone and the gold-rich intermetallic. Less gold dissolution and more ductile than lead-tin alloys. Good thermal fatigue properties. 50 50
In50Sn50 118/125 no Cerroseal 35. Fairly well wets glass, quartz and many ceramics. Malleable, can compensate some thermal expansion differences. Low vapor pressure. Used in low temperature physics as a glass-wetting solder. 50 50
In70Sn15Pb9.6Cd5.4 125 Pb,Cd 15 9.6 70 5.4
Pb75In25 250/264 240/260 Pb no In25. Low gold-leaching. Good thermal fatigue properties. Used for die attachment of e.g. GaAs dies. Used also for general circuit assembly and packaging closures. Less dissolution of gold and more ductile than tin-lead alloy. 75 25
Sn70Pb18In12 162
154/167
Pb yes General purpose. Good physical properties. 70 18 12
Sn37.5Pb37.5In25 134/181 Pb no Good wettability. Not recommended for gold. 37.5 37.5 25
Pb90In5Ag5 290/310 Pb no 90 5 5
Pb92.5In5Ag2.5 300/310 Pb no UNS L51510. Minimal leaching of gold, good thermal fatigue properties. Reducing atmosphere frequently used.. 92.5 2.5 5
Pb92.5In5Au2.5 300/310 Pb no In5 92.5 5 2.5
Pb94.5Ag5.5 305/364 304/343 Pb no Ag5.5, UNS L50180 94.5 5.5
Pb95Ag5 305/364 Pb no 95 5
Pb97.5Ag2.5 303 304 304/579 Pb yes no Ag2.5, UNS L50132. Used during World War II to conserve tin. Poor corrosion resistance; joints suffered corrosion in both atmospheric and underground conditions, all had to be replaced with Sn-Pb alloy joints. Torch solder. 97.5 2.5
Sn97.5Pb1Ag1.5 305 Pb yes Important for hybrid circuits assembly. 97.5 1 1.5
Pb97.5Ag1.5Sn1 309 Pb yes Ag1.5, ASTM1.5S. High melting point, used for commutators, armatures, and initial solder joints where remelting when working on nearby joints is undesirable. Silver content reduces solubility of silver coatings in molten solder. Not recommended for gold. Standard PbAgSn eutectic solder, wide use in semiconductor assembly. Reducing protective atmosphere (e.g. 12% hydrogen) often used. High creep resistance, for use at both elevated and cryogenic temperatures. 1 97.5 1.5
Pb54Sn45Ag1 177–210 Pb exceptional strength, silver gives it a bright long-lasting finish; ideal for stainless steel 45 54 1
Pb96Ag4 305 Pb high-temperature joints 96 4
Pb96Sn2Ag2 252/295 Pb Pb96 2 96 2
Sn61Pb36Ag3 Pb 61 36 3
Sn56Pb39Ag5 Pb 56 39 5
Sn98Ag2 98 2
Sn65Ag25Sb10 233 yes Very high tensile strength. For die attachment. Very brittle. Old Motorola die attach solder. 65 25 10
Sn96.5Ag3.0Cu0.5 217/220 217/218 near SAC305. It is the JEITA recommended alloy for wave and reflow soldering, with alternatives SnCu for wave and SnAg and SnZnBi for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn97Ag3 alloy. Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. 96.5 3 0.5
Sn95.8Ag3.5Cu0.7 217–218 near SN96C-Ag3.5 A commonly used alloy. Used for wave soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn96.5Ag3.5 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. 95.8 3.5 0.7
Sn95.6Ag3.5Cu0.9 217 yes Determined by NIST to be truly eutectic. 95.6 3.5 0.9
Sn95.5Ag3.8Cu0.7 217 almost SN96C. Preferred by the European IDEALS consortium for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn96.2Ag3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. 95.5 3.8 0.7
Sn95.25Ag3.8Cu0.7Sb0.25 Preferred by the European IDEALS consortium for wave soldering. 95.25 3.8 0.7 0.25
Sn95.5Ag3.9Cu0.6 217 yes Recommended by the US NEMI consortium for reflow soldering. Used as balls for BGA/CSP and CBGA components, a replacement for Sn10Pb90. Solder paste for rework of BGA boards. Alloy of choice for general SMT assembly. 95.5 3.9 0.6
Sn95.5Ag4Cu0.5 217 yes Lead Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications. 95.5 4 0.5
Sn96.5Ag3.5 221 yes Sn96, Sn96.5, 96S. Fine lamellar structure of densely distributed Ag3Sn. Annealing at 125 °C coarsens the structure and softens the solder. Creeps via dislocation climb as a result of lattice diffusion. Used as wire for hand soldering rework; compatible with SnCu0.7, SnAg3Cu0.5, SnAg3.9Cu0.6, and similar alloys. Used as solder spheres for BGA/CSP components. Used for step soldering and die attachment in high power devices. Established history in the industry. Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold. Marginal wetting. Good for step soldering. Used for soldering stainless steel as it wets stainless steel better than other soft solders. Silver content does not suppress dissolution of silver metallizations. High tin content allows absorbing significant amount of gold without embrittlement. 96.5 3.5
Sn96Ag4 221–229 no ASTM96TS. "Silver-bearing solder". Food service equipment, refrigeration, heating, air conditioning, plumbing. Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold. 96 4
Sn95Ag5 221/240 no Sn95. Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold. 95 5
Sn94Ag6 221/279 no Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 30,000 psi on Stainless. 94 6
Sn93Ag7 221/302 no Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 31,000 psi on Stainless. Audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance. 93 7
Sn95Ag4Cu1 95 4 1
Sn 232 pure Sn99. Good strength, non-dulling. Use in food processing equipment, wire tinning, and alloying. Susceptible to tin pest. 99.99
Sn99.3Cu0.7 227 yes Sn99Cu1. Also designated as Sn99Cu1. Cheap alternative for wave soldering, recommended by the US NEMI consortium. Coarse microstructure with ductile fractures. Sparsely distributed Cu6Sn5. Forms large dendritic ß-tin crystals in a network of eutectic microstructure with finely dispersed Cu6Sn5. High melting point unfavorable for SMT use. Low strength, high ductility. Susceptible to tin pest. Addition of small amount of nickel increases its fluidity; the highest increase occurs at 0.06% Ni. Such alloys are known as nickel modified or nickel stabilized. 99.3 0.7 (Ni)
Sn99Cu0.7Ag0.3 217/228 no SCA, SAC, or SnAgCu. Tin-silver-copper alloy. Relatively low-cost lead-free alloy for simple applications. Can be used for wave, selective and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn96.2Ag3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. 99 0.3 0.7
Sn97Cu3 227/250 232/332 For high-temperature uses. Allows removing insulation from an enameled wire and applying solder coating in a single operation. For radiator repairs, stained glass windows, and potable water plumbing. 97 3
Sn97Cu2.75Ag0.25 228/314 High hardness, creep-resistant. For radiators, stained glass windows, and potable water plumbing. Excellent high-strength solder for radiator repairs. Wide range of patina and colors. 97 0.25 2.75
Zn100 419 pure For soldering aluminium. Good wettability of aluminium, relatively good corrosion resistance. 100
Bi100 271 pure Used as a non-superconducting solder in low-temperature physics. Does not wet metals well, forms a mechanically weak joint. 100
Sn91Zn9 199 yes Designed specifically for Aluminum-to-Aluminum and Aluminum-to-Copper soldering. It has good corrosion resistance and tensile strength. Lies between soft solder and silver brazing alloys, thereby avoiding damage to critical electronics and substrate deformation and segregation. Best solder for Aluminum wire to Copper busses or Copper wire to Aluminum busses or contacts. 91 9
Sn85Zn15 199/260 no Designed specifically for Aluminum-to-Aluminum and Aluminum-to-Copper soldering. It has good corrosion resistance and tensile strength. Lies between soft solder and silver brazing alloys, thereby avoiding damage to critical electronics and substrate deformation and segregation. Has a wide plastic range this makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools. 85 15
Zn95Al5 382 yes For soldering aluminium. Good wetting. 95 Al5
Sn91.8Bi4.8Ag3.4 211/213 no Do not use on lead-containing metallizations. U.S. Patent 5,439,639 (ICA Licensed Sandia Patent). 91.8 3.4 4.8
Sn70Zn30 199/316 no For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn. 70 30
Sn80Zn20 199/288 no For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn. 80 20
Sn60Zn40 199/343 no For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn. 60 40
Pb63Sn35Sb2 185/343 Pb no Sb2 35 63 2
Pb63Sn34Zn3 170/256 Pb no Poor wetting of aluminium. Poor corrosion rating. 34 63 3
Pb92Cd8 310? Pb,Cd ? For soldering aluminium. US patent 1,333,666. 92 8
Sn48Bi32Pb20 140/160 Pb no For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. 48 20 32
Sn89Zn8Bi3 191–198 Prone to corrosion and oxidation due to its zinc content. On copper surfaces forms a brittle Cu-Zn intermetallic layer, reducing the fatigue resistance of the joint; nickel plating of copper inhibits this. 89 3 8
Sn83.6Zn7.6In8.8 181/187 no High dross due to zinc. Covered by U.S. Patent #5,242,658. 83.6 8.8 7.6
Sn86.5Zn5.5In4.5Bi3.5 174/186 no Lead-free. Corrosion concerns and high drossing due to zinc content. 86.5 3.5 4.5 5.5
Sn86.9In10Ag3.1 204/205 Potential use in flip-chip assembly, no issues with tin-indium eutectic phase. 86.9 3.1 10
Sn95Ag3.5Zn1Cu0.5 221L no 95 3.5 0.5 1
Sn95Sb5 235/240 232/240 no Sb5, ASTM95TA. The US plumbing industry standard. It displays good resistance to thermal fatigue and good shear strength. Forms coarse dendrites of tin-rich solid solution with SbSn intermetallic dispersed between. Very high room-temperature ductility. Creeps via viscous glide of dislocations by pipe diffusion. More creep-resistant than SnAg3.5. Antimony can be toxic. Used for sealing chip packagings, attaching I/O pins to ceramic substrates, and die attachment; a possible lower-temperature replacement of AuSn. High strength and bright finish. Use in air conditioning, refrigeration, some food containers, and high-temperature applications. Good wettability, good long-term shear strength at 100 °C. Suitable for potable water systems. Used for stained glass, plumbing, and radiator repairs. 95 5
Sn97Sb3 232/238 no 97 3
Sn99Sb1 232/235 no 99 1
Sn99Ag0.3Cu0.7 99 0.3 0.7
Sn96.2Ag2.5Cu0.8Sb0.5 217–225 217 Ag03A. Patented by AIM alliance. 96.2 2.5 0.8 0.5
Sn88In8.0Ag3.5Bi0.5 197–208 Patented by Matsushita/Panasonic. 88 3.5 0.5 8
Bi57Sn42Ag1 137/139 139/140 Addition of silver improves mechanical strength. Established history of use. Good thermal fatigue performance. Patented by Motorola. 42 1 57
Bi58Sn42 138 yes Bi58. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. Low-temperature eutectic solder with high strength. Particularly strong, very brittle. Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature was required. Can be used as a coating of copper particles to facilitate their bonding under pressure/heat and creating a conductive metallurgical joint. Sensitive to shear rate. Good for electronics. Used in thermoelectric applications. Good thermal fatigue performance. Established history of use. Expands slightly on casting, then undergoes very low further shrinkage or expansion, unlike many other low-temperature alloys which continue changing dimensions for some hours after solidification. 42 58
Bi58Pb42 124/126 Pb 42 58
In80Pb15Ag5 142/149
149/154
Pb no In80. Compatible with gold, minimum gold-leaching. Resistant to thermal fatigue. Can be used in step soldering. 15 5 80
Pb60In40 195/225 Pb no In40. Low gold-leaching. Good thermal fatigue properties. 60 40
Pb70In30 245/260 Pb no In30 70 30
Sn37.5Pb37.5In26 134/181 Pb no In26 37.5 37.5 26
Sn54Pb26In20 130/154 140/152 Pb no In20 54 26 20
Pb81In19 270/280 260/275 Pb no In19. Low gold-leaching. Good thermal fatigue properties. 81 19
In52Sn48 118 yes In52. Suitable for the cases where low-temperature soldering is needed. Can be used for glass sealing. Sharp melting point. Good wettability of glass, quartz, and many ceramics. Good low-temperature malleability, can compensate for different thermal expansion coefficients of joined materials. 48 52
Sn52In48 118/131 no very low tensile strength 52 48
Sn58In42 118/145 no 58 42
Sn51.2Pb30.6Cd18.2 145 Pb,Cd yes General-purpose. Maintains creep strength well. Unsuitable for gold. 51.2 30.6 18.2
Sn77.2In20Ag2.8 175/187 no Similar mechanical properties with Sn63Pb37, Sn62Pb36Ag2 and Sn60Pb40, suitable lead-free replacement. Contains eutectic Sn-In phase with melting point at 118 °C, avoid use above 100 °C. 77.2 2.8 20
In74Cd26 123 Cd yes 74 26
In61.7Bi30.8Cd7.5 62 Cd yes 30.8 61.7 7.5
Bi47.5Pb25.4Sn12.6Cd9.5In5 57/65 Pb,Cd no 12.6 25.4 47.5 5 9.5
Bi48Pb25.4Sn12.8Cd9.6In4 61/65 Pb,Cd no 12.8 25.4 48 9.6
Bi49Pb18Sn15In18 58/69 Pb no 15 18 49 18
Bi49Pb18Sn12In21 58 Pb yes Cerrolow 136. Slightly expands on cooling, later shows slight shrinkage in couple hours afterwards. Used as a solder in low-temperature physics. 12 18 49 21
Bi50.5Pb27.8Sn12.4Cd9.3 70/73 Pb,Cd no 12.4 27.8 50.5 9.3
Bi50Pb26.7Sn13.3Cd10 70 Pb,Cd yes Cerrobend. Used in low-temperature physics as a solder. 13.3 26.7 50 10
Bi44.7Pb22.6In19.1Cd5.3Sn8.3 47 Cd,Pb yes Cerrolow 117. Used as a solder in low-temperature physics. 8.3 22.6 44.7 19.1 5.3
In60Sn40 113/122 no 40 60
In51.0Bi32.5Sn16.5 60.5 yes Field's metal 16.5 32.5 51
Bi49.5Pb27.3Sn13.1Cd10.1 70.9 Pb,Cd yes Lipowitz Metal 13.1 27.3 49.5 10.1
Bi50.0Pb25.0Sn12.5Cd12.5 71 Pb,Cd yes Wood's metal, mostly used for casting. 12.5 25 50 12.5
Bi50.0Pb31.2Sn18.8 97 Pb no Newton's metal 18.8 31.2 50
Bi50Pb28Sn22 109 Pb no Rose's metal. It was used to secure cast iron railings and balusters in pockets in stone bases and steps. Does not contract on cooling. 22 28 50
Cd95Ag5 338/393 Cd no General purpose solder that will join all solderable metals except Aluminum. High temperature, high strength solder. It is used in applications where alloys melting higher than soft solders are required, but the cost and strength of Silver-brazing alloys is not necessary. 5 95
Cd82.5Zn17.5 265 Cd yes Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Also for soldering aluminium and die-cast zinc alloys. Used in cryogenic physics for ataching electrical potential leads to specimens of metals, as this alloy does not become superconductive at liquid helium temperatures. 17.5 82.5
Cd70Zn30 265/300 Cd no Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on Aluminum-to-Aluminum and Aluminum-to-Copper joints, with excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products. 30 70
Cd60Zn40 265/316 Cd no Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on Aluminum-to-Aluminum and Aluminum-to-Copper joints, with excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products. 40 60
Cd78Zn17Ag5 249/316 Cd no KappTecZ High temperature, high strength solder that may be used on most metals, but works extremely well on Aluminum, Copper and Stainless Steel. It has a high tolerance to vibration and stress, and good elongation for use on dissimilar metals. Above its liquidus of 600°F, this solder is extremely fluid and will penetrate the closest joints. 5 17 78
Sn40Zn27Cd33 176/260 Cd no Developed specifically to join and repair Aluminum and Aluminum/Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier. 40 27 33
Zn90Cd10 265/399 Cd For soldering aluminium. Good wetting. 90 10
Zn60Cd40 265/335 Cd For soldering aluminium. Very good wetting. 60 40
Cd70Sn30 140/160 Cd no Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics. 29.56 70.44
Sn50Pb32Cd18 145 Cd,Pb Cd18 50 32 18
Sn40Pb42Cd18 145 Cd,Pb Low melting temperature allows repairing pewter and zinc objects, including die-cast toys. 40 42 18
Zn70Sn30 199/376 no For soldering aluminium. Excellent wetting. Good strength. 30 70
Zn60Sn40 199/341 no For soldering aluminium. Good wetting. 40 60
Zn95Sn5 382 yes? For soldering aluminium. Excellent wetting. 5 95
Sn90Au10 217 yes 90 10
Au80Sn20 280 yes Au80. Good wetting, high strength, low creep, high corrosion resistance, high thermal conductivity, high surface tension, zero wetting angle. Suitable for step soldering. The original flux-less alloy, does not need flux. Used for die attachment and attachment of metal lids to semiconductor packages, e.g. kovar lids to ceramic chip carriers. Coefficient of expansion matching many common materials. Due to zero wetting angle requires pressure to form a void-free joint. Alloy of choice for joining gold-plated and gold-alloy plated surfaces. As some gold dissolves from the surfaces during soldering and moves the composition to non-eutectic state (1% increase of Au content can increase melting point by 30 °C), subsequent desoldering requires higher temperature. Forms a mixture of two brittle intermetallic phases, AuSn and Au5Sn. Brittle. Proper wetting achieved usually by using nickel surfaces with gold layer on top on both sides of the joint. Comprehensively tested through military standard environmental conditioning. Good long-term electrical performance, history of reliability. Low vapor pressure, suitable for vacuum work. Generally used in applications that require a melting temperature over 150°C. Good ductility. Also classified as a braze. 20 80
Au98Si2 370/800 Au98. A non-eutectic alloy used for die attachment of silicon dies. Ultrasonic assistance is needed to scrub the chip surface so a eutectic (3.1% Si) is reached at reflow. 98 Si2
Au96.8Si3.2 370 363 yes Au97. AuSi3.2 is a eutectic with melting point of 363 °C. AuSi forms a meniscus at the edge of the chip, unlike AuSn, as AuSi reacts with the chip surface. Forms a composite material structure of submicron silicon plates in soft gold matrix. Tough, slow crack propagation. 96.8 Si3.2
Au87.5Ge12.5 361 356 yes Au88. Used for die attachment of some chips. The high temperature may be detrimental to the chips and limits reworkability. 87.5 Ge12.5
Au82In18 451/485 no Au82. High-temperature, extremely hard, very stiff. 18 82
In100 157 pure In99. Used for die attachment of some chips. More suitable for soldering gold, dissolution rate of gold is 17 times slower than in tin-based solders and up to 20% of gold can be tolerated without significant embrittlement. Good performance at cryogenic temperatures. Wets many surfaces incl. quartz, glass, and many ceramics. Deforms indefinitely under load. Does not become brittle even at low temperatures. Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass with an ultrasonic soldering iron. 99.99

Temperature ranges for solidus and liquidus (the boundaries of the mushy state) are listed as solidus/liquidus.

In the Sn-Pb alloys tensile strength increases with increasing tin content. Indium-tin alloys with high indium content have very low tensile strength.

For soldering semiconductor materials, e.g. die attachment of silicon, germanium and gallium arsenide, it is important that the solder contains no impurities that could cause doping in wrong direction. For soldering n-type semiconductors, solder may be doped with antimony; indium may be added for soldering p-type semiconductors. Pure tin and pure gold can be used.

Various fusible alloys can be used as solders with very low melting points; examples include Field's metal, Lipowitz's alloy, Wood's metal, and Rose's metal.

Read more about this topic:  Solder

Other articles related to "solder alloys, solder":

Solder Alloys - Impurities in Solders
... Impurities usually enter the solder reservoir by dissolving the metals present in the assemblies being soldered ... materials are usually chosen to be insoluble in solder ... Aluminium – little solubility, causes sluggishness of solder and dull gritty appearance due to formation of oxides ...